Canteliver Probe Card
MPI Cantilever Probe Card is widely utilized on gold bump and pad wafer tests for Show driver, logic, and memory system. MPI’s cantilever probes are classified as the corresponding respond to towards the needs of fine pitch, smaller pad sizing, higher speed, a lot less cleansing, multi-DUT, superior pin count, and ultra-reduced leakage needs. With fantastic craftsmanship, innovative architecture and proven methodologies according to mechanical and electrical simulation/measurement final results, generating MPI the highest cantilever supplier around the world.
FCB Probe Card
The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) need. FCB is actually a verified Remedy for many different semiconductor manufacturing tests from early engineering pilot-operates to significant volume producing (HVM). FCB is ready for gadget demanding superior signal integrity probing (SI) and/or energy integrity probing (PI). Applications include things like slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and even more. FCB guarantees the whole world’s finest All round cost-of-possession (COO) for different DUT applications.
EVS Probe Card
The EVS Probe Card is really an enhancement around the traditional buckling beam probe card. Key options are increased present carrying ability (C.C.C.) and reduced well balanced Make contact with drive (BCF), and also General MEMS-like features. EVS can easily meet up with the requirement of State-of-the-art wafer probing. Precise alignment and exceptional planarity control are classified as the important variables contributing to secure Make contact with resistance. With its potential and overall performance, EVS Probe Card is a really perfect option for Superior probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s solution to need for at any time finer pitch. It is actually designed for more compact Al pad, and is particularly perfect for tiny pitch application with peripheral and entire array sample. With specific alignment and better planarity Handle, Osprey can get to bigger productivity by multi-DUT style. The forming wire (FW) variety needle generated with MPI’s have micro fabrication procedure not just delivers large-good quality general performance but also enables simple needle substitute and shortens check here preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle that's created for the desire of minimal power probing. Furthermore, it includes the chance to satisfy high C.C.C. and high pin counts software. The MEMS system makes sure remarkably reliable needle attributes, along with the Particular structure design permits exact alignment and planarity Handle.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/